EPOX 6WEA4I Spécifications télécharger pdf (Page 9)

IntroductionEP-6WEA4/4I

Page 1-3

The entire enclosed product is called the Pentium

II or Pentium

III Processor.

The packaging technology and each of the physical elements of the product are

referred to using accurate technical descriptions. This allows clear reference to

the products as just a processor. This is the model used in past packaging tech-

nologies like PGA, TCP, PQFP, DIP, etc.

S.E.C. Cartridge Terminology

• Pentium

II or Pentium

III Processor

The new enclosed card packaging technology is called a “Single Edge

Contact cartridge.” This is similar to previous names for packaging

technology such as PGA or TCP.

• Processor card

The green PCB (with or without components on it)

• Processor core

The silicon on the PLGA package on the PCB

• Cover

The plastic cover on the opposite side from the thermal plate.

• Slot 1

The slot that the S.E.C. cartridge plugs into, just as the Pentium

Pro

processor uses Socket 8.

• Retention mechanism

Formerly ‘retention module’ the dual posts, etc. that holds the cartridge in

place.

• Thermal plate

The heatsink attach-

ment plate.

• Heat sink supports

The support pieces that

are mounted on the

mainboard to provide

added support for

heatsinks.

Figure 1: Pentium

II/III Processor CPU

with S.E.C.C. or S.E.C.C.2 Package

Pentium

II Processor

in an S.E.C.C. Package

Pentium

III Processor

in an S.E.C.C.2 Package

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EPOX 6WEA4I Spécifications Page 9

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